SERIAL ITEM TECHNICAL DATA
1 Layers 2－30(layers)
2 Max Board Size 18" x 24"
3 Min Board Thickness 4（layers）16mil
                                 6（layers）32mil
                                 8（layers）40mil
                                 10（layers）48mil
4 Min Line Width 3mil
5 Min Line Space 3mil
6 Min Hole Size 6mil
7 PTH Wall Thickness 0.8mil
8 PTH dia tolerance ±2mil
9 NPTH hole dia tolerance ±1mil
10 Hole Position Deviation ±2mil
11 Outline Tolerance ±4mil
12 S/M Pitch 3mil
13 Insulation Resistance 1E+12Ω(Normal)
14 Aspect ratio 10:1
15 Thermal Shock 3x10Sec@288 ℃
16 Warp and Twist ≤0.7%
17 Electric Strength ＞1.3KV/mm
18 Peel Strength 1.4N/mm
19 Solder Mask Abrasion ≥6H
20 Flammability 94V-0
21 Impedance Control ±5%